Vertical Interconnect Accesses - Do you even RF? (Part II)
A while ago I promised to look into the effects of using VIAs (Vertical Interconnect Access) on RF tracks to change layers on PCBs. Unlike the 90ยบ degree bends on PCB tracks, in this case there's essentially two postures about the matter. Either people are completely clueless of the potential risk of placing a via on a RF track and do it recklessly. Or they're somehow a little aware of the risks, therefore completely demonize such practice, going at extreme lengths such as increasing the track sizes immensely (making it even worst), just so to avoid the use of the via. A long time ago I found an awesome primer about vias for high-speed and RF tracks from Keysight, you can find it here . However, it focuses mainly on multi-layer board in excess of 8 layers. Therefore, although the concepts are the same and the material is absolutely valuable no matter your scenario, it lacks the actual results you'd get in a 2 or 4 layer board. I've been cooking this post for a while,